Composite materials have been and continue to be widely used in semiconductor, aerospace, automotive, ship­ building and other industries due to their tailorability for specific applications. Composite multi-functionality is typically achieved through the addition of filler materials to impart the requisite level of thermal or electrical conductivity or to customize the material modulus.

Filler materials of various composition, size, and structure have been investigated for composite manufacturing and each offers unique challenges associated with the addition of the filler particles negatively impacting the polymer processing. For example, even at relatively low loading levels (e.g., < 5 weight percent), the addition of nanoparticle-based filler materials can result in significant increases in host polymer viscosity, rendering these systems incompatible with filament winding and other manufacturing techniques. Moreover, the surface chemistry of the nanoscale filler materials dictates particle interactions with the polymer matrix and concomitantly the strength characteristics of the resulting composite.

A current need exists for semiconductor packaging applications due to the continuing reduction in feature size driving more stringent requirements for the thermal dissipation performance of the packaging materials.

In the ideal case, one would be able to individually select a target polymer and the appropriate filler materials necessary to impart performance functionality for a given application and then tailor the particle properties to ensure strong interfacial adhesion between the filler and polymer to achieve the desired performance.

Atomic layer deposition of sub-nanometer coatings on nano- and microscale particles in a fluidized bed reactor is an exciting technology that provides a mechanism to tailor the particle surface chemistry to optimize particle/polymer interaction while maintaining the bulk properties of the filler additives. Developed by the University of Colorado and ALD NanoSolutions, Inc., in Broomfield, CO, the ALD-FBR technology has been licensed by NanoDynamics, Inc. and is being applied to extend the applicability of boron nitride fillers for thermal management systems, in addition to a host of other core materials including nanoscale nickel, copper and silver particles as well as high purity multi-wall carbon nanotubes materials.

The ALD-FBR technology is currently being scaled to meet market demand in multiple application spaces and technology licensing opportunities are available for your particular field of use.