Electronics, photonics, and sensor techniques are based on single crystalline materials, and the brittleness of those materials and fragility of the devices present increasingly serious problems for the technology. Increasing the thickness of the wafers means a proportional increase in cost. Quasam™ is a relatively inexpensive technology providing a marked decrease in material brittleness and device structure fragility.

In principle, graphite in plane is harder and stronger than diamond; however, weak inter-plane bonds make graphite a soft, low-modulus material. Quasam™ combines both major carbon forms, graphite and diamond, in an atomic scale hierarchical carbon-carbon composite structure, wherein graphite bonded with a diamond framework demonstrates exceptional strength.

Quasam™ may be deposited on semiconductors, metals, and ceramics.

Quasam™ improves the resistance of crystals, wafers, and solid-state devices and structures to mechanical deformation and thus increases their flexibility and strength. For example, the strength of silicon-Quasam interface bonding exceeds the intrinsic silicon strength. Furthermore, Quasam™ increases the thermal shock resistance of structures, and its deposition technology is compatible with existing microelectronic technology.

There exists a relatively narrow range of coating thickness that provides the substrate with a strong increase of its flexibility. This optimum thickness range depends on the nature of the substrate and the structure of the coatings, and is often about 0.1 micrometer to about 10 micrometers. Quasam™ has been demonstrated to provide a 2 to 3-fold increase in the critical angle of bending.

Conventional diamond-like carbon coatings do not adhere well to glass. Due to their composition of chemically complimentary elements O, C, and Si, Quasam™ possesses excellent adhesion to glass. There are many applications for glass where the performance of the product is limited by the brittleness of the glass. Quasam™ coatings on glass result in up to an 80% increase in the critical deformation limit of glass, while simultaneously providing anti-abrasion protection and UV protection. Metal-doped Quasam™ films also provide surface conductivity, and may be used for the electrical heating of the glass substrate. For example, architectural and automotive glass can also be strengthened by Quasam™, as well as glass fiber.

This portfolio includes theorical technology:

• Published patent regarding wafer applications
• Disclosed technology regarding glass applications.

Related Quasam™ materials and other technology applications are in theoretical levels of development.