Products | Materials | Metals | Silver
ND Silver
Ranging from 40 nm to 80 nm, NDSilver powder and platelets are unique in that they are stable at elevated temperatures and do not exhibit room temperature sintering and migration. ND Silver materials have been engineered for increased electrical conductivity, in low-temperature processing scenarios. They are provided as dry powders, or as a wet raw material “pre-dispersion” for ease of handling and dispersion into your final printable systems .
| Product # | Description | Technical Data Sheets | MSDS |
| S2-80 | Mono-sized 80 spherical Silver powder | S2-80 | S2-80 |
| S2-80E | 80nm spherical Silver "Pre-Dispersion", 55-75 wt% in Ethanol | S2-80E | S2-80E |
| S2-80W | 80nm spherical Silver "Pre-Dispersion", 55-75 wt% in Water | S2-80W | S2-80W |
| S2-30E | 30-40nm spherical Silver "Pre-Dispersion", 40-50 wt% in Ethanol | S2-30E | S2-30E |
| S2-30W | 30-40nm spherical Silver "Pre-Dispersion", 40-50 wt% in Water | S2-30W | S2-30W |
| S3-500 | Silver Platelet 60x600 nm | S3-500 | S3-500 |
| S3-500E | Silver Platelet "Pre-Dispersion", 60x600 nm, 60-75 wt% in Ethanol | S3-500E | S3-500E |
| S3-500W | Silver Platelet "Pre-Dispersion", 60x600 nm, 60-75 wt% in Water | S3-500W | S3-500W |
Samples of custom engineered Ag materials - as small as 10nm - can be contract manufactured through our subsidiary MetaMateria Partners.
NanoDynamics® chemically precipitated NDSilver powders and flakes allow for:
- fine-line print definition
- low temperature electrical conductivity on paper and polymer substrates
- tight control over printing rheology via tightly controlled particle size distributions
- customized surface chemistries for a variety of conductive inks and adhesives
- reduction in silver usage due to thinner print thicknesses

